A Message from the 2026 EPS Organizing Committee:
Our 37th annual Electronics Packaging Symposium will take place Sept. 9 and 10, 2026, at the Innovative Technology Complex at ÀÖ²¥´«Ã½. We will focus on various aspects of electronic packaging and how advanced packaging is evolving toward a Chiplet future.
Registration
EXECUTIVE CHAIRS:
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Dr. Mukesh V. Khare Vice President, Semiconductor and AI Hardware IBM Research |
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Dr. Bahgat Sammakia Director, S3IP ÀÖ²¥´«Ã½ |
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Cliff Macklin Technology Director, Digital & Electrical Systems GE Research |